EE 2033 MICRO ELECTRO MECHANICAL SYSTEMS
AIM
The aim of this course is to educate the student to understand the fundamentals of Micro
Electro Mechanical Systems (MEMS)
OBJECTIVES
At the end of this course the student will be able to
integrate the knowledge of semiconductors and solid mechanics to fabricate
MEMS devices.
understand the rudiments of Microfabrication techniques.
identify and understand the various sensors and actutators
different materials used for MEMS
applications of MEMS to disciplines beyond Electrical and Mechanical
engineering.
UNIT I INTRODUCTION 9
Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and
Actuators – Introduction to Microfabrication - Silicon based MEMS processes – New
Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor
devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.
UNIT II SENSORS AND ACTUATORS-I 9
Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger
capacitor – Comb drive devices – Thermal Sensing and Actuation – Thermal expansion
– Thermal couples – Thermal resistors – Applications – Magnetic Actuators –
Micromagnetic components – Case studies of MEMS in magnetic actuators.
UNIT III SENSORS AND ACTUATORS-II 9
Piezoresistive sensors – Piezoresistive sensor materials - Stress analysis of mechanical
elements – Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric
sensors and actuators – piezoelectric effects – piezoelectric materials – Applications to
Inertia , Acoustic, Tactile and Flow sensors.
UNIT IV MICROMACHINING 9
Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma
Etching – Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase
Etchants – Case studies - Basic surface micromachining processes – Structural and
Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods
– Assembly of 3D MEMS – Foundry process.
UNIT V POLYMER AND OPTICAL MEMS 9
Polymers in MEMS– Polimide - SU-8 - Liquid Crystal Polymer (LCP) – PDMS – PMMA –
Parylene – Fluorocarbon - Application to Acceleration, Pressure, Flow and Tactile
sensors- Optical MEMS – Lenses and Mirrors – Actuators for Active Optical MEMS.
TOTAL : 45 PERIODS
TEXT BOOKS.
1. Chang Liu, ‘Foundations of MEMS’, Pearson Education Inc., 2006.
2.. James J.Allen, micro electro mechanical system design, CRC Press published in
2005
REFERENCES
1. Nadim Maluf, “ An introduction to Micro electro mechanical system design”, Artech
House, 2000.
2. Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2000
3. Tai Ran Hsu, “MEMS & Micro systems Design and Manufacture” Tata McGraw Hill,
New Delhi, 2002.
4. Julian w. Gardner, Vijay k. varadan, Osama O.Awadelkarim,micro sensors mems and
smart devices, John Wiley & son LTD,2002
AIM
The aim of this course is to educate the student to understand the fundamentals of Micro
Electro Mechanical Systems (MEMS)
OBJECTIVES
At the end of this course the student will be able to
integrate the knowledge of semiconductors and solid mechanics to fabricate
MEMS devices.
understand the rudiments of Microfabrication techniques.
identify and understand the various sensors and actutators
different materials used for MEMS
applications of MEMS to disciplines beyond Electrical and Mechanical
engineering.
UNIT I INTRODUCTION 9
Intrinsic Characteristics of MEMS – Energy Domains and Transducers- Sensors and
Actuators – Introduction to Microfabrication - Silicon based MEMS processes – New
Materials – Review of Electrical and Mechanical concepts in MEMS – Semiconductor
devices – Stress and strain analysis – Flexural beam bending- Torsional deflection.
UNIT II SENSORS AND ACTUATORS-I 9
Electrostatic sensors – Parallel plate capacitors – Applications – Interdigitated Finger
capacitor – Comb drive devices – Thermal Sensing and Actuation – Thermal expansion
– Thermal couples – Thermal resistors – Applications – Magnetic Actuators –
Micromagnetic components – Case studies of MEMS in magnetic actuators.
UNIT III SENSORS AND ACTUATORS-II 9
Piezoresistive sensors – Piezoresistive sensor materials - Stress analysis of mechanical
elements – Applications to Inertia, Pressure, Tactile and Flow sensors – Piezoelectric
sensors and actuators – piezoelectric effects – piezoelectric materials – Applications to
Inertia , Acoustic, Tactile and Flow sensors.
UNIT IV MICROMACHINING 9
Silicon Anisotropic Etching – Anisotrophic Wet Etching – Dry Etching of Silicon – Plasma
Etching – Deep Reaction Ion Etching (DRIE) – Isotropic Wet Etching – Gas Phase
Etchants – Case studies - Basic surface micromachining processes – Structural and
Sacrificial Materials – Acceleration of sacrificial Etch – Striction and Antistriction methods
– Assembly of 3D MEMS – Foundry process.
UNIT V POLYMER AND OPTICAL MEMS 9
Polymers in MEMS– Polimide - SU-8 - Liquid Crystal Polymer (LCP) – PDMS – PMMA –
Parylene – Fluorocarbon - Application to Acceleration, Pressure, Flow and Tactile
sensors- Optical MEMS – Lenses and Mirrors – Actuators for Active Optical MEMS.
TOTAL : 45 PERIODS
TEXT BOOKS.
1. Chang Liu, ‘Foundations of MEMS’, Pearson Education Inc., 2006.
2.. James J.Allen, micro electro mechanical system design, CRC Press published in
2005
REFERENCES
1. Nadim Maluf, “ An introduction to Micro electro mechanical system design”, Artech
House, 2000.
2. Mohamed Gad-el-Hak, editor, “ The MEMS Handbook”, CRC press Baco Raton, 2000
3. Tai Ran Hsu, “MEMS & Micro systems Design and Manufacture” Tata McGraw Hill,
New Delhi, 2002.
4. Julian w. Gardner, Vijay k. varadan, Osama O.Awadelkarim,micro sensors mems and
smart devices, John Wiley & son LTD,2002
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